Pure Thermal Conductivity

PUre Thermal Conductivity

We are the experts for thermally conductive potting systems. With our products we offer the perfect solution for efficient thermal management. With their diverse material properties, our casting compounds already meet the requirements in the field of e-mobility.

 
By using innovative fillers, we achieve excellent thermal conductivities with reduced abrasiveness, good processability and excellent flow properties. These property profiles predestine our systems for use in the field of power electronics, battery and accumulator technology as well as for the encapsulation of electric motors. Especially in sensitive applications, our silicone-free systems with comparatively low hardness are an attractive alternative to silicone-based gap fillers. By using our unique heat-conductive potting compounds, we can increase the performance and efficiency of the power components, improve the heat dissipation of assemblies and also solve technologically demanding challenges.
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100 : 8
100 : 10
100 : 8
100 : 8
100 : 8
2.800 - 3.500
4.000 - 9.000
8.000 - 12.000
10.000 - 15.000
55.000 - 75.000
D 30 - 40
D 20 - 30
D 50 - 60
D 50 - 55
D 35 - 45
1,5
1,5
2,1
2,6
3,5

Mixing ratio

[Harz : Härter] 

Mixed viscosity 

[mPa*s bei 22°C] 

Hardness

[Shore D] 

Thermal conductivity

[W/m*K] 

PURe
Conduction
FR22
PURe
Conduction
ST 25
PURe
Conduction
ST 27
PURe
Conduction
ST 28
PURe
Conduction
ST 29
PURe
Conduction
ST 30
100 : 7
26.000 - 36.000
D 40 - 50
3,0